For semiconductor and advanced-packaging teams

Die, bump, and substrate inspection with per-unit traceable evidence.

Controlled inspection for advanced packaging — die placement, solder-bump and interconnect defects, substrate marking and OCR — with per-unit replayable records and defect-trend visibility.

Run the live inspection cycle Build a station fit report

Semiconductor & Advanced Packaging inspection-to-evidence story

Step 1: the Semiconductor & Advanced Packaging inspection cell is running.
Step 2: inspection identifies micro-defect cluster on the panel.
Step 3: sealed evidence: die · lot · defect map.
Step 4: a Risk Review draft is prepared — yield-risk review packet prepared for engineering.
Step 5: human approval is required before any decision; nothing is released or closed automatically.
Step 6: traceable per-unit evidence ready to export.

From factory signal to audit-ready record

Human-controlled

System preparedHuman approval requiredNo automatic release

Where teams usually start

Die-attach / placement verification
Bump / interconnect inspection
Substrate marking & OCR check

Example part & rule

Example part Populated PCB

Reject a solder bridge above 0.25 mm in a critical region.

measured 0.4 mmlimit 0.25 mm

REJECT

solder bridgemissing componenttombstonemarking error

Discovery questions for the conversation

Where does your current AOI or metrology coverage stop?
Which packaging defects escape to final test today?
What per-unit traceability do your customers require?

Which inspection station should we map first?

The goal is to identify one station where this could matter — then validate with your approved parts and criteria.

Build the deployment plan

This is an example workflow for semiconductor & advanced packagingteams — a hypothesis, not a claim about any specific company's process.

Demo scenes are illustrative and use deterministic product scenarios. Regulated decisions remain human-controlled.