Skip to content
HoldField
← Demo console
SignalMicro-defect cluster on the panel — defect heatmap across the substrate.

For semiconductor and advanced-packaging teams

Die, bump, and substrate inspection with per-unit traceable evidence.

See tiny defects become traceable yield-risk evidence without burying engineers in screenshots.

diebumptraceRisk Review · review required
Run the live inspection cycleBuild a pilot fit report

Semiconductor & Advanced Packaging inspection-to-evidence story

  1. Step 1: the Semiconductor & Advanced Packaging inspection cell is running.
  2. Step 2: inspection identifies micro-defect cluster on the panel.
  3. Step 3: sealed evidence: die · lot · defect map.
  4. Step 4: a Risk Review draft is prepared — yield-risk review packet prepared for engineering.
  5. Step 5: human approval is required before any decision; nothing is released or closed automatically.
  6. Step 6: traceable per-unit evidence ready to export.

From factory signal to audit-ready record

Human-controlled
System preparedHuman approval requiredNo automatic release

Where teams usually start

  1. Die-attach / placement verification
  2. Bump / interconnect inspection
  3. Substrate marking & OCR check

Example part & rule

Example part Populated PCB

Reject a solder bridge above 0.25 mm in a critical region.

measured 0.4 mmlimit 0.25 mm
REJECT
solder bridgemissing componenttombstonemarking error

Discovery questions for the conversation

Which inspection station should we map first?

The goal is to identify one station where this could matter — then validate with your approved parts and criteria.

Build the pilot plan

This is an example workflow for semiconductor & advanced packagingteams — a hypothesis, not a claim about any specific company's process.

Demo scenes are illustrative and use deterministic product scenarios. Regulated decisions remain human-controlled.