HoldFieldElectronics Assembly
Per-board evidence with marking and OCR bound together.
Example part: Populated PCB. Suggested first pilot: Final QC / label verification.
Example workflow tailored to this manufacturing profile. Not a customer claim.Today's pain
- Fine-pitch defects
- Label / marking errors
- Throughput pressure
- Traceability
Defect families
solder bridgemissing componenttombstonemarking error
Signature inspection rule
Reject a solder bridge above 0.25 mm in a critical region (fine-pitch connector).
In this example run the part measured 0.4 mm → REJECT.
Evidence need
Per-board evidence with marking/OCR verification.
Recommended demo: circuitcell — AOI checks the board; CircuitCell proves the product — serial-level evidence across the build chain.