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Electronics Assembly

Per-board evidence with marking and OCR bound together.

Signature inspection rule

solder bridgeOver limit → reject
measured 0.4 mmlimit 0.25 mm
critical region · fine-pitch connector

Reject a solder bridge above 0.25 mm in fine-pitch connector → this run sealed REJECT.

Defect families

solder bridgemissing componenttombstonemarking error

Sample part

Populated PCBFirst deployment: Final QC / label verification

Today's pain

Fine-pitch defectsLabel / marking errorsThroughput pressureTraceability

Evidence need

Per-board evidence with marking/OCR verification.

Recommended: circuitcell
Run the live cycle for this partBuild a station fit reportExample workflow tailored to this manufacturing profile. Not a customer claim.